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HomeCatalogASRock 4U10G-EGS2 — Full Technical Specifications

Technical specifications

ASRock 4U10G-EGS2 — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Form Factor4U Rackmount
Dimensions786 x 438 x 176.5 mm (30.9'' x 17.2'' x 6.9'')
Support MotherboardSP2C741D32G-2L+
ButtonsPower button w/ LED, Reset button, NMI button, UID button
LEDsSystem fault LED, HDD activity LED
I/O Ports2 RJ45 (1GbE) by Intel i350, shares with Rear IO; 1 dedicated IPMI, shares with Rear IO; 4 Type-A (USB3.2 Gen1); 1 DB15 (VGA)
Front Side Drive Bay16 hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays, 2 hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays, 8 hot-swap 2.5" SATA drive bays (2 shards with 2.5" NVMe); 16 Hot-swap 2.5" SATA/SAS* drive bays; *Additional RAID/HBA card required to support the 20 x 2.5" SATA/SAS drive bays
Front Side Backplane24-port NVMe/SATA/SAS* passive backplanes *SAS drive is only supported with additional RAID/HBA cards
Internal Side1 M-key (PCIe3.0 x4 or SATA 6Gb/s), supports 2280/22110 form factor [PCH]; 1 M-key (PCIe3.0 x4), supports 2280/22110 form factor [PCH]
Type3+1 CRPS
Output Watts1000W @ 100-127Vac input / 2000W @ 200-240Vac input
Efficiency80-PLUS Platinum
AC InputLow-line: 100-127Vrms, 47/63Hz ; High-line: 200-240Vrms, 47/63Hz
Fan5 Middle Hot-swap 80x80 mm fans
CPUSupports 5th and 4th Gen Intel® Xeon® Scalable Processors
SocketDual Socket E (LGA 4677)
Thermal Design PowerUp to 400W
ChipsetC741
Supported DIMM Quantity16+16 DIMM slots (2DPC)
Supported TypeSupports DDR5 288-pin RDIMM, RDIMM-3DS
Max. Capacity per DIMMRDIMM: 96GB (2R); RDIMM-3DS: 512GB (2S8Rx4)
Max. DIMM Frequency5600 MT/s (1DPC) / 4400 MT/s (2DPC) on 5th Gen Intel® Xeon® Scalable Processors; 4800 MT/s (1DPC) / 4400 MT/s (2DPC) on 4th Gen Intel® Xeon® Scalable Processors; *Memory speed and capacity support varies by CPU SKU
Voltage1.1V
PCIe x 16Rear:; 10 FHFL dual-slot PCIe5.0 x16 (with PEX89104 PCIe Switch); 1 FHFL single-slot PCIe5.0 x16 (CPU direct link); Front:; 2 FHHL PCIe5.0 x16
PCIe x 8Rear:; 2 FHFL single-slot PCIe5.0 x8, shared space with adjacent dual-slot (with PEX89104 PCIe Switch)
Additional Ethernet ControllerIntel® i350: 2 RJ45 (1GbE)
OCP slot1 OCP NIC 3.0 (PCIe5.0 x16)
BMC ControllerASPEED AST2600
Dedicated IPMI LAN1 Realtek RTL8211F for dedicated management GLAN
ControllerASPEED AST2600
VRAMDDR4 512MB
UID Button/LED1 UID button
Video Port1 DB15 (VGA)
USB 3.2 Gen1 Port2 Type-A (USB3.2 Gen1)
RJ452 RJ45 (1GbE) by Intel i350, shares with Front Panel; 1 dedicated IPMI, shares with Front Panel
BIOS TypeAMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
BIOS FeaturesASRock Rack Instant Flash, ACPI 6.4 and about compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
TemperatureCPU, MB, Card side Temperature Sensing
FanFan Tachometer; CPU Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature); Fan Multi-Speed Control
VoltageP0_VDDCR_CPU0, P0_VDDCR_CPU1, P0_VDDCR_SOC, P0_VDD_18_DUAL, P0_VDD_11_S3, P0_VDDIO, P1_VDDCR_CPU0, P1_VDDCR_CPU1, P1_VDDCR_SOC, P1_VDD_18_DUAL, P1_VDD_11_S3, P1_VDDIO, +BAT, +12V, +3VSB, +5VSB
TemperatureOperating temperature: 10°C ~ 35°C / Non-operating temperature: -40°C ~ 70°C
HumidityNon-operating humidity: 20% ~ 90% (non-condensing)

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