Technical specifications
ASRock MECAI-GH200 — Full Technical Specifications
Official datasheet
Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.
Full Specifications
| Form Factor | 2U NVIDIA® MGX™ |
| Dimensions | 420 x 438 x 87 mm (16.5'' x 17.2'' x 3.4'') |
| Buttons | Reset, Power, UID |
| I/O Ports | 1 Mini DisplayPort (VGA), 1 Micro USB (COM), 1 Type-A (USB3.2 Gen1) |
| IPMI LAN | 1 dedicated IPMI |
| Front Side Drive Bay | 2 E1.S (PCIe5.0 x4), supports 9.5mm width |
| Internal Side | 2 M-key (PCIe5.0 x4), supports 22110/2280 form factor |
| Type | 1+1 CRPS |
| Output Watts | 2000W |
| Fan | 6 PWM fixed 60x76 mm fans |
| CPU | NVIDIA® GH200 GH200 Grace Hopper™ Superchip:; 1x NVIDIA® Grace™ CPU Superchip; 1x NVIDIA® Hopper™ GPU Superchip; NVIDIA® NVLink - C2C for CPU-GPU interconnect |
| Thermal Design Power | Up to 1000W (CPU + GPU + Memory) |
| Supported Type | Grace CPU: Supports LPDDR5X memory with ECC; Hopper H100 GPU: Supports HBM3 or HBM3e (coming soon) |
| Max. Capacity per DIMM | Grace CPU: 480GB; Hopper H100 GPU: 96GB (HBM3) or 144GB (upcoming HBM3e) |
| Max. DIMM Frequency | Grace CPU: 512GB/s; Hopper H100 GPU: 4TB/s (HBM3) or 4.9TB/s (upcoming HBM3e) |
| PCIe x 16 | 1 HHHL single-slot PCIe5.0 x16 for NVIDIA® ConnectX-7 NICs; 1 FHHL dual-slot PCIe5.0 x16 for NVIDIA® BlueField-3 DPUs |
| BMC Controller | ASPEED AST2600 |
| Dedicated IPMI LAN | 1 Realtek RTL8211F for dedicated management GLAN |
| Temperature | Operating temperature: 10°C ~ 40°C / Non-operating temperature: -40°C ~ 70°C |
| Humidity | Non-operating humidity: 20% ~ 90% (non-condensing) |
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