Technical specifications
Gigabyte B343-X40-AAS1 — Full Technical Specifications
Official datasheet
Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.
Full Specifications
| Dimensions (WxHxD, mm) | 3U 10-Node - Front access; 447 x 132 x 770 |
| Motherboard | MX44-BL0 |
| CPU | Intel® Xeon® 6300-Series Processors; Intel® Xeon® E-2400 Processors; Single processor per node, TDP up to 95 W |
| Socket | 10 x LGA 1700 |
| Chipset | Intel® C262 |
| Memory | 4 x DIMM slots per node; Support DDR5 ECC UDIMM; Dual Channel memory per processor; Up to 4400 MT/s (1DPC), 4000 MT/s (2DPC/1R), 3600 MT/s (2DPC/2R) |
| LAN | Front (I/O board - CDCB010):; 2 x 1 Gb/s LAN (1 x Intel® I350-AM2) per node; - Support NCSI function; 1 x 10/100/1000 Mb/s Management LAN per node; Rear:; 2 x Chassis Management LAN [1]; [1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.; |
| Video | Integrated in ASPEED® AST2600; - 1 x Mini-DP per node |
| Storage | Internal:; 2 x 2.5" Gen4 NVMe/SATA per node; Internal M.2:; 1 x M.2 (2280/22110) per node, PCIe Gen3 x2, from PCH |
| PCIe Expansion Slots | Riser Card CRCB010:; - 1 x FHHL x16 (Gen5 x16) per node, from CPU; 3 x OCP NIC 3.0 (Gen4 x4 per node), from PCH [1]; [1] Supports only validated multi-host add-in NIC cards.; |
| Front I/O | Per node:; 1 x Power button with LED; 1 x ID button with LED; 1 x System status LED; I/O board - CDCB010:; 2 x USB 3.2 Gen1 ports (Type-A); 1 x Mini-DP; 2 x RJ45 ports; 1 x MLAN port; 1 x ID LED |
| Rear I/O | 2 x CMC ports |
| Security Modules | 1 x TPM header with SPI interface per node; - Optional TPM 2.0 kit: CTM010 |
| Power Supply[#1] | 1+1 3200 W 80 PLUS Titanium redundant power supplies [1]; AC Input:; - 100-127V~/ 16A, 50-60Hz; - 200-220V~/ 16A, 50-60Hz; - 220-240V~/ 16A, 50-60Hz; DC Input: (Only for China); - 240Vdc/ 16A; DC Output:; - Max 1300W/ 100-127V~; +12.2V/ 106.6A; +12.2Vsb/ 3A; - Max 3000W/ 200-220V~; +12.2V/ 246A; +12.2Vsb/ 3A; - Max 3200W/ 220-240V~ or 240Vdc Input; +12.2V/ 262.3A; +12.2Vsb/ 3A; [1] The system power supply requires C19 power cord.; |
| System Fans | 5 x 80x80x80mm |
| Operating Properties | Operating temperature: 10°C to 30°C; Operating humidity: 8% to 80% (non-condensing); Non-operating temperature: -40°C to 60°C; Non-operating humidity: 20% to 95% (non-condensing) |
| Weight | Net Weight: 37 kg; Gross Weight: 71 kg |
| Packaging Dimensions | 1100 x 700 x 564 mm |
| Packaging Content | 1 x B343-X40-AAS1; 10 x CPU heatsinks; 1 x Mini-DP to D-Sub cable; 1 x L-shape Rail kit |
| Part Numbers | - Barebone package: 6NB343X40MR000AAS1*; - Motherboard: 9MX44BL0NR-000*; - L-shape Rail kit: 25HB2-A86108-K0R; - CPU heatsink: 25ST1-300001-A3R; - M.2 heatsink: 12SP2-11000E-00GR; - Backplane board - CBPB020: 9CBPB020NR-00*; - Fan module: 25ST2-88802J-A0R; - Riser card - CRCB010: 9CRCB010NR-00*; - OCP card - CPBBE50: 9CPBBE50NR-00*; - CMC card - CNBB90: 9CNBB90NR-00*; - I/O board - CDCB010: 9CDCB010NR-00*; - MLAN board - CLBH010: 9CLBH010NR-00*; - Mini-DP to D-Sub cable: 25CRN-200801-K1R; - Power supply: 25EP0-232006-G1S |
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