Gigabyte G4L4-SD3-LAX7 — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Dimensions (WxHxD, mm)	4U; 447 x 175.5 x 901
Motherboard	MSB4-PE3
CPU	Intel® Xeon® 6 Processors; - Intel® Xeon® 6700-Series Processors; - Intel® Xeon® 6500-Series Processors; [DLC] Dual processors, TDP up to 350 W; [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.;
Socket	2 x LGA 4710; Socket E2
Chipset	System on Chip
Memory	[DLC] 32 x DIMM slots; Support DDR5 RDIMM/MRDIMM [1]; 8-Channel memory per processor; RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM: Up to 8000 MT/s; [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores and only in a 1DPC configuration.;
LAN	Front (I/O board):; 2 x 10 Gb/s LAN (1 x Intel® X710-AT2); - Support NCSI function; 1 x 10/100/1000 Mb/s Management LAN; Rear:; [DLC] 8 x 800 Gb/s OSFP XDR InfiniBand or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™; Rear (MLAN board):; 1 x 10/100/1000 Mb/s Management LAN; [Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.;
Video	Integrated in ASPEED® AST2600; - 1 x VGA port
Storage	Front hot-swap:; 8 x 2.5" Gen5 NVMe; - (NVMe from PEX89072); Internal M.2:; 1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1; 1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
Modular GPU	[DLC] NVIDIA HGX™ B300 with 8 x SXM GPUs
PCIe Expansion Slots	PCIe Bridge Board x 2:; - 4 x FHHL x16 (Gen5 x16), from PEX89072; [Note] The ambient temperature is limited to 30°C when NVIDIA BlueField®-3 DPUs/SuperNIC™ are installed.;
Front I/O	I/O board:; 2 x USB 3.2 Gen1 ports (Type-A); 1 x VGA port; 2 x RJ45 ports; 1 x MLAN port (default); 1 x Power button with LED; 1 x ID button with LED; 1 x NMI button; 1 x Reset button; 1 x Storage activity LED; 1 x System status LED
Rear I/O	8 x OSFP ports; MLAN board:; 1 x MLAN port
Security Modules	1 x TPM header with SPI interface; - Optional TPM 2.0 kit: CTM012
Power Supply[#1]	5+5 3000 W 80 PLUS Titanium redundant power supplies [1]; AC Input:; - 115-127V~/ 14.2A, 50-60Hz; - 200-220V~/ 15.8A, 50-60Hz; - 220-240V~/ 14.9A, 50-60Hz; DC Input: (Only for China); - 240Vdc/ 14A; DC Output:; - Max 1450W/ 115-127V~; +54V/ 26.6A; +12Vsb/ 3A; - Max 2900W/ 200-220V~; +54V/ 53.4A; +12Vsb/ 3A; - Max 3002.4W/ 220-240V~ or 240Vdc Input; +54V/ 55.6A; +12Vsb/ 3A; [1] The system power supply requires C19 power cord.;
System Fans	Motherboard:; 2 x 60x60x38mm; 3 x 60x60x56mm; PCIe slots:; 2 x 80x80x56mm
Operating Properties	Operating temperature: 10°C to 35°C; Operating humidity: 8% to 80% (non-condensing); Non-operating temperature: -40°C to 60°C; Non-operating humidity: 20% to 95% (non-condensing); [Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.;
Weight	Net Weight: 60 kg; Gross Weight: 70 kg
Packaging Dimensions	1300 x 800 x 444 mm
Packaging Content	1 x G4L4-SD3-LAX7; 4 x Carriers; 1 x L-shape Rail kit
Part Numbers	- Barebone with NVIDIA module: 6NG4L4SD3DR000LAX7; - Motherboard: 9MSB4PE3UR-000; - L-shape Rail kit: 25HB2-A96102-K0R; - Front panel board - CFPG440: 9CFPG440NR-00; - Backplane board - CBPG641: 9CBPG641NR-00

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