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HomeCatalogGigabyte H253-Z10-LAP1 — Full Technical Specifications

Technical specifications

Gigabyte H253-Z10-LAP1 — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Dimensions (WxHxD, mm)2U 4-Node - Front access; 447 x 87 x 887
MotherboardMZ13-SH0
CPUAMD EPYC™ 9005 Series Processors; AMD EPYC™ 9004 Series Processors; Single processor per node, cTDP up to 500W
Socket4 x LGA 6096; Socket SP5
ChipsetSystem on Chip
Memory96 x DIMM slots; DDR5 memory supported; 12-Channel memory per processor; AMD EPYC™ 9005:; RDIMM: Up to 5200 MT/s (1DPC); RDIMM: Up to 4400 MT/s (1R 2DPC), 4000 MT/s (2R 2DPC); AMD EPYC™ 9004:; RDIMM: Up to 4800 MT/s (1DPC), 3600 MT/s (2DPC)
LANFront:; 8 x 1Gb/s LAN (4 x Intel® I350-AM2); - Support NCSI function; 4 x 10/100/1000 Mbps Management LAN; Rear:; 2 x CMC ports; [Note] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.;
VideoIntegrated in ASPEED® AST2600 x 4; - 4 x Mini-DP
StorageFront hot-swap:; 8 x 9.5mm E1.S Gen4 NVMe; Internal M.2:; 4 x M.2 (2280/22110), PCIe Gen5 x4; 8 x M.2 (2280), SATA via ASM1062R; - Support SATA Hardware RAID 0/1
SASN/A
RAIDN/A
PCIe Expansion Slots4 x OCP NIC 3.0 (Gen5 x16); - Support NCSI function
Front I/O8 x USB 3.2 Gen1 ports (Type-A); 4 x Mini-DP; 8 x RJ45 ports; 4 x MLAN ports; 4 x Power buttons with LED; 4 x ID buttons with LED; 4 x Reset buttons; 4 x System status LEDs
Rear I/O2 x CMC ports
Backplane BoardN/A
Security Modules1 x TPM header with SPI interface; - Optional TPM2.0 kit: CTM010
Power Supply[#1]Dual 3000W 80 PLUS Titanium redundant power supply [1]; AC Input:; - 100-127V~/ 15.5A, 50-60Hz; - 200-220V~/ 15.5A, 50-60Hz; - 220-240V~/ 15.5A, 50-60Hz; DC Input: (Only for China); - 240Vdc/ 15.5A; DC Output:; - Max 1000W/ 100-127V~; +12.2V/ 81A; +12Vsb/ 3A; - Max 2600W/ 200-220V~; +12.2V/ 213A; +12Vsb/ 3A; - Max 3000W/ 220-240V~ or 240Vdc Input; +12.2V/ 245A; +12Vsb/ 3A; [1] The system power supply requires C19 power cord.;
System ManagementASPEED® AST2600 Baseboard Management Controller; ASPEED® AST2520 Chassis Management Controller; GIGABYTE Management Console web interface; Dashboard; HTML5 KVM; Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.); Sensor Reading History Data; FRU Information; SEL Log in Linear Storage / Circular Storage Policy; Hardware Inventory; Fan Profile; System Firewall; Power Consumption; Power Control; Advanced power capping; LDAP / AD / RADIUS Support; Backup & Restore Configuration; Remote BIOS/BMC/CPLD Update; Event Log Filter; User Management; Media Redirection Settings; PAM Order Settings; SSL Settings; SMTP Settings;
OS CompatibilityPlease refer to OS compatibility table in support page; Additional certifications:; VMware ESXi 8.0
System Fans4 x 80x80x80mm
Operating PropertiesOperating temperature: 10°C to 35°C; Operating humidity: 8% to 80% (non-condensing); Non-operating temperature: -40°C to 60°C; Non-operating humidity: 20% to 95% (non-condensing); [Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.;
WeightNet Weight: 28.2 kg; Gross Weight: 31 kg
Packaging Dimensions1181 x 718 x 336 mm
Packaging Content1 x H253-Z10-LAP1; 4 x GIGABYTE CPU cold plate loops; 1 x Mini-DP to D-Sub cable; 1 x L-shape Rail kit
Part Numbers- Barebone with cold plates: 6NH253Z10DR000LCP1*; - Barebone without cold plates: 6NH253Z10DZ000LCP1*; - Motherboard: 9MZ13SH0UR-000-3*; - L-shape Rail kit: 25HB2-A86104-K0R; - GIGABYTE CPU cold plate loop: 25ST7-20000J-J2R; - Fan module: 25ST2-888020-S1R; - EDSFF riser card - CRSH01X: 9CRSH01XNR-00*; - CMC module - CMBH42: 9CMBH42NR-00*; - Mini-DP to D-Sub cable: 25CRN-200801-K1R; - Power supply: 25EP0-23000R-G1S; Optional parts:; - E1.S Latch with dummy tray (24 in 1): 6NH253Z10S1000AAP11

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