Gigabyte H274-S61-IAW1 — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Dimensions (WxHxD, mm)	2U 4-Node; 440 x 87.5 x 877
Motherboard	MS64-HD0
CPU	Intel® Xeon® 6 Processors; - Intel® Xeon® 6700-Series Processors; - Intel® Xeon® 6500-Series Processors; Dual processor per node, TDP up to 350 W; [Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.;
Socket	8 x LGA 4710; Socket E2
Chipset	System on Chip
Memory	64 x DIMM slots; Support DDR5 RDIMM/MRDIMM [1]; 8-Channel memory per processor; RDIMM: Up to 6400 MT/s; MRDIMM: Up to 8000 MT/s; [1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores.;
LAN	Top (I/O board x 4):; 8 x 1 Gb/s LAN (4 x Intel® I350-AM2); - Support NCSI function; 4 x 10/100/1000 Mb/s Management LAN [1]; [1] Spanning Tree Protocol (STP) must be enabled on LAN switches when using a ring topology.;
Video	Integrated in ASPEED® AST2600 x 4; - 4 x Mini-DP
Storage	Bottom:; 8 x 2.5" Gen5 NVMe/SATA/SAS-4 [1]; - (NVMe & SATA from CPU_1); Optional internal M.2 (Riser card x 4):; 4 x M.2 (2260/2280/22110), PCIe Gen4 x4, from CPU_1; [1] SAS card is required to support SAS drives.;
PCIe Expansion Slots	8 x LP x16 (Gen5 x16), from CPU_0; 4 x OCP NIC 3.0 (Gen5 x16), from CPU_0; - Support NCSI function
Top I/O	I/O board x 4:; 8 x USB 3.2 Gen1 ports (Type-A); 4 x Mini-DP; 8 x RJ45 ports; 4 x MLAN ports; 4 x System status LEDs
Security Modules	4 x TPM headers with SPI interface; - Optional TPM 2.0 kit: CTM012; 4 x PRoT connectors (only enabled on RoT SKU)
Power Supply[#1]	Dual 3000 W 80 PLUS Titanium redundant power supplies [1]; AC Input:; - 100-127V~/ 16A, 50/60Hz; - 200-207V~/ 16A, 50/60Hz; - 208-240V~/ 16A, 50/60Hz; DC Input: (Only for China); - 240Vdc/ 16A; DC Output:; - Max 1200W/ 100-127V~; +12.2V/ 98.36A; +12.2Vsb/ 3A; - Max 2600W/ 200-207V~; +12.2V/ 213A; +12.2Vsb/ 3A; - Max 3000W/ 208-240V~ or 240Vdc Input; +12.2V/ 245.9A; +12.2Vsb/ 3A; [1] The system power supply requires C19 power cord.;
OS Certifications	VMware ESXi 8.0Windows Server 2025
Operating Properties	Operating coolant temperature: 20°C to 35°C; Non-operating temperature: -40°C to 60°C; Non-operating humidity: 20% to 95% (non-condensing)
Packaging Dimensions	1184 x 706 x 394 mm
Packaging Content	1 x H274-S61-IAW1; 8 x CPU heatsinks; 1 x Mini-DP to D-Sub cable; 16 x Carriers
Part Numbers	- Barebone package: 6NH274S61DR000IAW1; - Motherboard: 9MS64HD0UR-000; Optional parts:; - M.2 riser card - CMTP160: 9CMTP160NR-00*

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