Technical specifications
Lenovo ThinkSystem SR675 V3 — Full Technical Specifications
Official datasheet
Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.
Full Specifications
| Form Factor | 3U rack server |
| CPU | 1x or 2x 4th/5th Gen AMD EPYC |
| DIMM Slots | 24 DDR5 (12 channels per CPU at 1DPC), up to 6400 MHz |
| Max RAM | 6 TB (24x256 GB DDR5) |
| GPU | Up to 8x double-wide 600W GPUs (PCIe Gen5 x16); HGX H200 4-GPU SXM5 (700W) module |
| Drive Bays | Base: 8x 2.5" SAS/SATA/NVMe; Dense: 6x E1.S or 4x E3.S NVMe; HGX: 4x 2.5" NVMe or 4x E3.S NVMe |
| PCIe Slots | Up to 6x PCIe Gen5 x16 + 1x OCP NIC 3.0 |
| PSU | 4x N+N redundant hot-swap, up to 2600W Titanium |
| Cooling | Air cooling or Lenovo Neptune liquid-to-air hybrid (HGX H200 models) |
| Management | Lenovo HPC & AI Software Stack (Confluent, LiCO) |
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