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HomeCatalogDell PowerEdge R670 — Full Technical Specifications

Technical specifications

Dell PowerEdge R670 — Full Technical Specifications

The R670 is the two-socket Xeon 6 machine in Dell's thinnest rack profile — very high core counts, very fast networking and storage that has moved almost entirely to the ruler format. It is aimed at estates building dense compute and at anyone whose workload has outgrown what a previous generation fitted in the same height. It is ordered new and built against your configuration.

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Begin with the processor row, which offers efficiency-core and performance-core parts that are not variations of one thing — they differ in how many threads you get, how fast each one is, and what the memory subsystem does. Choose there, then read the network row, because this model expects the data-processing and high-speed adapter options listed and is priced on the assumption that the network is doing real work. The cooling row names a liquid option, which in a chassis this thin with processors this hot is more than a footnote and is a decision about the room. Storage in the ruler format will not accept drives from an older estate.

Form Factor1U rack
CPU2x Intel Xeon 6 (6700E E-core up to 144c or 6500P/6700P P-core up to 86c)
CPU Sockets2
MemoryDDR5 RDIMM, 6400 MT/s; 32GB/64GB DIMMs; up to 32 DIMM slots
Drive BaysUp to 10x 2.5" SAS4/SATA/NVMe or up to 20x EDSFF E3.S Gen5 NVMe
Storage ControllerPERC H365i, H965i; Front PERC 12/13
PCIe SlotsUp to 2x Gen5 x16 FH; Riser Config 5
OCP SlotsOCP 3.0, 1GbE to 400GbE (Broadcom/Intel/NVIDIA)
GPU/DPUNVIDIA L4, BlueField-3 DPU/SuperNIC (200-400GbE NDR)
PSU800W-1800W Titanium/Mixed Mode; 1400W -48VDC
CoolingAir cooling or Direct Liquid Cooling (DLC) option
Dimensions1U rack
ManagementiDRAC10, OpenManage Enterprise

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