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HomeCatalogLenovo ThinkEdge SE360 V2 Enclosure — Full Technical Specifications

Technical specifications

Lenovo ThinkEdge SE360 V2 Enclosure — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Form Factor2U half-width edge server (84.5x212x317.5 mm)
CPU1-socket Intel Xeon D-2700, up to 16 cores
DIMM Slots4x DDR4-3200 TruDDR4, max 256 GB (4x64 GB)
Max RAM256 GB
Drive Bays2x M.2 NVMe boot + up to 2x 2.5" 7mm SATA/NVMe hot-swap + up to 8x M.2 NVMe data
GPU1x PCIe Gen4 x16 HHHL (75W) + 1x PCIe Gen4 x16 FHHL (150W): NVIDIA A2, L4, Intel Flex 140, Qualcomm Cloud AI 100
RAIDBoot: 0/1; Data: 0/1/5/10
Networking4x 10/25 GbE SFP28 + 2x 2.5 GbE TSN; Wireless: 4x SMA WLAN + Bluetooth
PSUDual redundant external 300W AC or DC 12-48V; or single internal 500W AC
Environmental0-55°C (extended -20 to 65°C), IP3X, Marine cert optional
ManagementLenovo XClarity Controller (wired + wireless failover)

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