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HomeCatalogLenovo ThinkSystem SR850 — Full Technical Specifications

Technical specifications

Lenovo ThinkSystem SR850 — Full Technical Specifications

Official datasheet

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Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

CPU Sockets4 (2 on system board + 2 on expansion tray; can start with 2)
CPU FamilyIntel Xeon Scalable (1st Gen Skylake Gold/Platinum), LGA 3647, up to 28 cores, up to 205W TDP, 3.6 GHz
ChipsetIntel C624
Max RAM6 TB (48 x 128 GB 3DS RDIMM, requires M-suffix CPUs)
DIMM Slots48 TruDDR4 (12 per CPU, 6 channels per CPU)
Memory TypeTruDDR4 RDIMM (up to 1.5 TB), LRDIMM (up to 3.0 TB), 3DS RDIMM (up to 6.0 TB), 2666 MHz
Drive BaysUp to 16 x 2.5" hot-swap SAS/SATA/NVMe (up to 8 AnyBay)
Storage ControllerRAID 530i/730-8i/930-8i/16i/24i; HBA 430-8i/16i; NVMe Switch Adapter 1610-4P or onboard NVMe ports
NetworkIntegrated Intel X722 + LOM (1/10 GbE); ML2 adapters (10/25 GbE, InfiniBand)
PSUUp to 2x redundant hot-swap: 750W (110/220V), 1100W, 1600W (220V only), 80 PLUS Platinum
Form Factor2U rack-mount
ManagementXClarity Controller Advanced (standard), Enterprise (optional), XClarity Administrator
Dimensions445 x 87 x 765 mm (17.5 x 3.4 x 30.1 in)
Weight18-27 kg
GPU SupportNot supported (full-length cards do not fit)
Cooling6 hot-swap 60mm redundant fans (16K or 19K RPM), N+1 redundancy
PCIe SlotsUp to 9 PCIe 3.0 slots + dedicated LOM + M.2 slot
M.2 BootSingle or dual M.2 adapter (RAID-1), up to 480 GB SATA

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Same 1-yr warranty, same QC