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HomeCatalogLenovo ThinkSystem SR860 V3 — Full Technical Specifications

Technical specifications

Lenovo ThinkSystem SR860 V3 — Full Technical Specifications

Official datasheet

Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

Form Factor4U rack
CPUUp to 4x 4th Gen Intel Xeon Scalable (Sapphire Rapids), up to 60c, 350W; 3 UPI @ 16 GT/s
CPU Sockets4
ChipsetIntel C741 Emmitsburg
Memory64x DDR5 (16 per CPU), up to 16 TB (64x256GB 3DS RDIMM); up to 24 TB with Optane PMem 300; 4800 MT/s
Drive BaysUp to 48x 2.5" hot-swap SAS/SATA/AnyBay (up to 24 NVMe)
Storage ControllerOnboard NVMe VROC, 12Gb SAS RAID/HBA (Broadcom, up to 32 ports, 8GB flash)
PCIe SlotsUp to 18 slots (Gen4/Gen5 mix) + 2x OCP 3.0 (Gen5 x16)
GPU SupportUp to 8x SW or 4x DW GPUs
Network2x OCP 3.0 up to 100GbE
PSUUp to 4x hot-swap 80 PLUS Platinum/Titanium, 1100-2600W; N+N redundancy
Cooling12x N+1 hot-swap 60mm dual-rotor fans
ManagementXClarity Controller 2 (XCC2) Platinum; CXL v1.1 Ready

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