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HomeCatalogLenovo ThinkSystem SR950 — Full Technical Specifications

Technical specifications

Lenovo ThinkSystem SR950 — Full Technical Specifications

Official datasheet

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Original spec sheet © Vendor. Hosted by hardwaresys for buyer reference. Specifications subject to vendor’s published documentation.

Full Specifications

CPU Sockets2-8 (expandable from 2 to 8 processors)
CPU FamilyIntel Xeon Scalable (1st Gen Skylake / 2nd Gen Cascade Lake), Gold/Platinum, up to 28 cores, up to 205W TDP, up to 3.8 GHz
ChipsetIntel C624
Max RAM24 TB (96 x 256 GB 3DS RDIMM); up to 36 TB with DCPMM (24 TB persistent + 12 TB DRAM)
DIMM Slots96 TruDDR4 (12 per CPU)
Memory TypeTruDDR4 RDIMM/LRDIMM/3DS RDIMM 2666/2933/2933 Performance+ MHz; Optane DC Persistent Memory up to 48 x 512 GB
Drive BaysUp to 24 x 2.5" hot-swap SAS/SATA; up to 12 AnyBay (NVMe support)
Storage ControllerRAID 530-8i/540-8i/730-8i/930-8i/16i/940-8i/16i; HBA 430-8i/16i/440-8i/16i
NetworkIntel X722 10Gb via PCH; LOM slot (1/10 GbE); ML2 slots (1/10/25 GbE, InfiniBand)
PSUUp to 4x hot-swap N+N redundant: 1100W (auto-sensing), 1600W, 2000W (200-240V), 80 PLUS Platinum
Form Factor4U rack-mount
ManagementXClarity Controller Enterprise (standard), XClarity Administrator, XClarity Energy Manager, IPMI 2.0
Dimensions447 x 176 x 851 mm (17.6 x 6.9 x 33.5 in)
Weight32.6-58.7 kg
GPU SupportNot supported (full-length cards do not fit)
Cooling6 hot-swap fans per compute tray (N+1), 19K RPM fans for ASHRAE A4 support
PCIe SlotsUp to 17 rear PCIe 3.0 (FHHL or LP) + 2 internal dedicated for RAID/HBA + 1 M.2
Operating EnvironmentASHRAE A4 (up to 45°C) with restrictions

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